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收起展开制造商 :
Rohm SemiconductorMicrochip TechnologyToshibaTexas Instruments德州ON SemiconductorMaxim 美信Allegro MicroSystems, LLC
关闭工作温度 :
-20°C ~ 105°C-20°C ~ 85°C-25°C ~ 85°C-40°C ~ 105°C-40°C ~ 125°C-40°C ~ 150°C-40°C ~ 70°C-40°C ~ 85°C0°C ~ 70°C0°C ~ 85°C
关闭封装/外壳 :
10-TFSOP,10-MSOP(0.118",3.00mm 宽)16-SOIC(0.295",7.50mm 宽)16-SSOP(0.154",3.90mm 宽)20-SOIC(0.433",11.00mm 宽)裸露焊盘20-TSSOP(0.173",4.40mm 宽)裸露焊盘20-VFQFN 裸露焊盘24-SOIC(0.295",7.50mm 宽)24-WFQFN 裸露焊盘28-SOIC(0.173",4.40mm 宽)裸露焊盘28-VFQFN 裸露焊盘28-WFQFN 裸露焊盘32-VFQFN 裸露焊盘36-VFQFN 裸露焊盘38-TFSOP(0.173",4.40mm 宽)8-SOIC(0.154",3.90mm 宽)8-SOIC(0.173",4.40mm 宽)8-TSSOP,8-MSOP(0.118",3.00mm 宽)8-UFDFN 裸露焊盘TO-263-8,D²Pak(7 引线+接片),TO-263CA
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