浏览历史
暂无数据
产品筛选
收起展开制造商 :
Amulet Technologies LLCAnalog Devices (AD)AtmelAVAGOCypress Semiconductor CorpFairchild 仙童IDT, Integrated Device Technology IncLinear TechnologyMaxim 美信Micrel IncMicrochip TechnologyNXP SemiconductorsOONON SemiconductorPanasonic (松下)Power IntegrationsSharp MicroelectronicsSTMicroelectronics意法半导体Texas Instruments德州WINBOND安森美(ON)
关闭封装/外壳 :
10-TFSOP,10-MSOP(0.118",3.00mm 宽)10-WFDFN10-WFDFN 裸露焊盘14-SOIC(0.154",3.90mm 宽)14-TSSOP(0.173",4.40mm 宽)16-VFQFN 裸露焊盘20-SSOP(0.209",5.30mm 宽)24-WFQFN 裸露焊盘,CSP6-LSOJ6-TSSOP,SC-88,SOT-3636-WDFN 裸露焊盘8-SOIC(0.154",3.90mm 宽)8-TSSOP(0.173",4.40mm 宽)8-UFDFN 裸露焊盘8-WFDFN 裸露焊盘80-BQFPSC-74A,SOT-753TO-226-3、TO-92-3 标准主体TO-236-3,SC-59,SOT-23-3TO-252-3,DPak(2 引线+接片),SC-63TO-261-4,TO-261AA
关闭专用 IC
图片 | 型号 | 制造商 | 货期 | 批号 | 库存 | 单价 | 购买 | |
---|---|---|---|---|---|---|---|---|
WINBOND | - | 10+ | 4171 | 暂无价格 | ||||
WINBOND | - | 08+09+10+ | 640 | 暂无价格 | ||||
WINBOND | - | 08+ | 338 | 暂无价格 | ||||
WINBOND | - | 06+ | 160 | 暂无价格 | ||||
WINBOND | - | 11+ | 66 | 暂无价格 | ||||
WINBOND | - | 1012+ | 1188 | 暂无价格 | ||||
WINBOND | - | 0609+ | 553 | 暂无价格 | ||||
WINBOND | - | 10+ | 30637 | 暂无价格 | ||||
WINBOND | - | 10+ | 30636 | 暂无价格 | ||||
WINBOND | - | 10+ | 30635 | 暂无价格 | ||||
WINBOND | - | 10+ | 30634 | 暂无价格 | ||||
WINBOND | - | 10+ | 30633 | 暂无价格 | ||||
WINBOND | - | 10+ | 30632 | 暂无价格 | ||||
WINBOND | - | 10+ | 30631 | 暂无价格 | ||||
WINBOND | - | 10+ | 30630 | 暂无价格 | ||||
WINBOND | - | 10+ | 30629 | 暂无价格 | ||||
WINBOND | - | 10+ | 30628 | 暂无价格 | ||||
WINBOND | - | 10+ | 30627 | 暂无价格 | ||||
WINBOND | - | 10+ | 30626 | 暂无价格 | ||||
WINBOND | - | 10+ | 30625 | 暂无价格 | ||||
WINBOND | - | 10+ | 30624 | 暂无价格 | ||||
WINBOND | - | 10+ | 30623 | 暂无价格 | ||||
WINBOND | - | 10+ | 30622 | 暂无价格 | ||||
WINBOND | - | 10+ | 30621 | 暂无价格 | ||||
WINBOND | - | 10+ | 30620 | 暂无价格 | ||||
WINBOND | - | 10+ | 30619 | 暂无价格 | ||||
WINBOND | - | 10+ | 30618 | 暂无价格 | ||||
WINBOND | - | 10+ | 30617 | 暂无价格 |